PolyMide CoPA Technical Data Sheet
PolyMide CoPA Technical Data Sheet
Identification
| Product Name |
PolyMide_CoPA |
| Product Use |
3D Printing Filament |
| Manufacturer/Supplier |
JF Polymers (Suzhou) Co., Ltd. |
| Address |
2901 Auburn Rd, Auburn Hills, MI 48326 |
| Contact Email |
info@rev1tech.com |
| Telephone |
+248-707-2950 |
| Emergency Telephone Number |
+248-707-2950 |
Properties
| Density |
ISO1183, GB/T1033 |
1.12 g/cm³ at 23°C |
| Melt Index |
260°C, 1.2 kg |
12 g/10min |
| Light Transmission |
N/A |
N/A |
| Flame Retardancy |
N/A |
N/A |
| Effect of Weak Acids |
Not Resistant |
| Effect of Strong Acids |
Not Resistant |
| Effect of Weak Alkalis |
Slightly Resistant |
| Effect of Strong Alkalis |
Not Resistant |
| Effect of Organic Solvent |
Not Resistant |
| Effect of Oils and Grease |
Resistant |
| Equilibrium Water Absorption |
2.82% |
Thermal Properties
| Glass Transition Temperature |
DSC, 10°C/min |
67°C |
| Melting Temperature |
DSC, 10°C/min |
190°C |
| Crystallization Temperature |
DSC, 10°C/min |
128°C |
| Decomposition Temperature |
TGA, 20°C/min |
370°C |
| Vicat Softening Temperature |
ISO 306, GB/T 1633 |
180°C |
| Heat Deflection Temperature (1.8MPa) |
ISO 75 |
69.8°C |
| Heat Deflection Temperature (0.45MPa) |
ISO 75 |
110.5°C |
Mechanical Properties
| Young’s Modulus (X-Y) |
ISO 527, GB/T 1040 |
2223 ± 199 MPa |
| Young’s Modulus (Z) |
2564 ± 97 MPa |
| Tensile Strength (X-Y) |
ISO 527, GB/T 1040 |
66.2 ± 0.9 MPa |
| Tensile Strength (Z) |
43.3 ± 9.1 MPa |
| Elongation at Break (X-Y) |
ISO 527, GB/T 1040 |
9.9 ± 1.5% |
| Elongation at Break (Z) |
1.8 ± 0.4% |
| Bending Modulus (X-Y) |
ISO 178, GB/T 9341 |
1667 ± 118 MPa |
| Bending Modulus (Z) |
N/A |
| Bending Strength (X-Y) |
ISO 178, GB/T 9341 |
97 ± 1.1 MPa |
| Bending Strength (Z) |
N/A |
| Charpy Impact Strength (X-Y) |
ISO 179, GB/T 1043 |
9.6 ± 1.4 kJ/m² |
| Charpy Impact Strength (Z) |
N/A |
| Low Temperature Impact Strength (X-Y) |
ISO 179-1/1eA:2010, -30°C |
4.5 ± 1.5 kJ/m² |
Printing Recommendations
- Abrasion of the brass nozzle happens quite often when printing PolyMide™ CoPA. A wear-resistant nozzle, such as hardened steel and ruby nozzle, is highly recommended to be used with PolyMide™ CoPA.
- PolyMide™ CoPA is sensitive to moisture and should always be stored and used under dry conditions (relative humidity below 20%).
- If PolyMide™ CoPA is used as the support material for itself, please remove the support structure before excessive moisture absorption. Otherwise, the support structure can be permanently bonded to the model.
- After the printing process, it is recommended to anneal the model in the oven at 80°C for 6 hours.
Printing Parameters
| Nozzle Temperature |
250 – 270°C |
| Build Surface Material |
PA film, PI film |
| Build Surface Treatment |
Glue |
| Build Plate Temperature |
25 - 50°C |
| Cooling Fan |
OFF |
| Printing Speed |
30-60 mm/s |
| Raft Separation Distance |
0.2 mm |
| Retraction Distance |
3 mm |
| Retraction Speed |
40 mm/s |
| Environmental Temperature |
40 - 60°C |
| Threshold Overhang Angle |
55° |
| Recommended Support Material |
PolyDissolve™ S1 |
Disclaimer
The typical values presented in this data sheet are intended for reference and comparison purposes only. They should not be used for design specifications or quality control purposes. Actual values may vary significantly with printing conditions. End-use performance of printed parts depends not only on materials, but also on part design, environmental conditions, printing conditions, etc. Product specifications are subject to change without notice.
Each user is responsible for determining the safety, lawfulness, technical suitability, and disposal/recycling practices of Rev1Tech materials for the intended application. Rev1Tech makes no warranty of any kind, unless announced separately, to the fitness for any use or application. Rev1Tech shall not be made liable for any damage, injury, or loss induced from the use of Rev1Tech materials in any application.
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